JPH0328749U - - Google Patents
Info
- Publication number
- JPH0328749U JPH0328749U JP8937389U JP8937389U JPH0328749U JP H0328749 U JPH0328749 U JP H0328749U JP 8937389 U JP8937389 U JP 8937389U JP 8937389 U JP8937389 U JP 8937389U JP H0328749 U JPH0328749 U JP H0328749U
- Authority
- JP
- Japan
- Prior art keywords
- leads
- bending
- bending part
- resin package
- surface mount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8937389U JPH0328749U (en]) | 1989-07-28 | 1989-07-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8937389U JPH0328749U (en]) | 1989-07-28 | 1989-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0328749U true JPH0328749U (en]) | 1991-03-22 |
Family
ID=31638951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8937389U Pending JPH0328749U (en]) | 1989-07-28 | 1989-07-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0328749U (en]) |
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1989
- 1989-07-28 JP JP8937389U patent/JPH0328749U/ja active Pending